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P6SMB11CAT3 Series
600 Watt Peak Power Zener Transient Voltage Suppressors
Bidirectional*
The SMB series is designed to protect voltage sensitive components from high voltage, high energy transients. They have excellent clamping capability, high surge capability, low zener impedance and fast response time. The SMB series is supplied in ON Semiconductor's exclusive, cost-effective, highly reliable Surmetict package and is ideally suited for use in communication systems, automotive, numerical controls, process controls, medical equipment, business machines, power supplies and many other industrial/consumer applications.
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* * * * * * * * *
Working Peak Reverse Voltage Range - 9.4 to 77.8 V Standard Zener Breakdown Voltage Range - 11 to 91 V Peak Power - 600 W @ 1 ms ESD Rating of Class 3 (>16 KV) per Human Body Model Maximum Clamp Voltage @ Peak Pulse Current Low Leakage < 5 mA Above 10 V UL 497B for Isolated Loop Circuit Protection Response Time is Typically < 1 ns Pb-Free Packages are Available
PLASTIC SURFACE MOUNT ZENER OVERVOLTAGE TRANSIENT SUPPRESSORS 9.4-78 VOLTS 600 WATT PEAK POWER
SMB CASE 403A PLASTIC
Mechanical Characteristics: CASE: Void-Free, Transfer-Molded, Thermosetting Plastic FINISH: All External Surfaces are Corrosion Resistant and Leads are
MARKING DIAGRAM
Readily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260C for 10 Seconds LEADS: Modified L-Bend Providing More Contact Area to Bond Pads POLARITY: Polarity Band Will Not be Indicated MOUNTING POSITION: Any
MAXIMUM RATINGS
Rating Peak Power Dissipation (Note 1) @ TL = 25C, Pulse Width = 1 ms DC Power Dissipation @ TL = 75C Measured Zero Lead Length (Note 2) Derate Above 75C Thermal Resistance, Junction-to-Lead DC Power Dissipation (Note 3) @ TA = 25C Derate Above 25C Thermal Resistance, Junction-to-Ambient Operating and Storage Temperature Range Symbol PPK PD RqJL PD RqJA TJ, Tstg Value 600 3.0 40 25 0.55 4.4 226 -65 to +150 Unit W W mW/C C/W W mW/C C/W C
AYWW xxC G G
xxC = Device Code A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
Device P6SMBxxCAT3 P6SMBxxCAT3G Package SMB SMB (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. 10 X 1000 ms, non-repetitive 2. 1 square copper pad, FR-4 board 3. FR-4 board, using ON Semiconductor minimum recommended footprint, as shown in 403A case outline dimensions spec. *Please see P6SMB6.8AT3 to P6SMB200AT3 for Unidirectional devices.
(c) Semiconductor Components Industries, LLC, 2006
The "T3" suffix refers to a 13 inch reel. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Devices listed in bold, italic are ON Semiconductor Preferred devices. Preferred devices are recommended choices for future use and best overall value.
1
July, 2006 - Rev. 8
Publication Order Number: P6SMB11CAT3/D
P6SMB11CAT3 Series
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted) Symbol IPP VC VRWM IR VBR IT QVBR Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Maximum Temperature Coefficient of VBR IPP IT VC VBR VRWM IR IR V RWM VBR VC IT IPP I
V
Bi-Directional TVS
ELECTRICAL CHARACTERISTICS (Devices listed in bold, italic are ON Semiconductor Preferred devices.)
VRWM (Note 4) Volts 9.4 10.2 11.1 12.8 13.6 15.3 17.1 18.8 20.5 23.1 25.6 28.2 30.8 33.3 36.8 40.2 43.6 47.8 53 58.1 64.1 70.1 77.8 IR @ VRWM mA 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Breakdown Voltage VBR Volts (Note 5) Min 10.5 11.4 12.4 14.3 15.2 17.1 19 20.9 22.8 25.7 28.5 31.4 34.2 37.1 40.9 44.7 48.5 53.2 58.9 64.6 71.3 77.9 86.5 Nom 11.05 12 13.05 15.05 16 18 20 22 24 27.05 30 33.05 36 39.05 43.05 47.05 51.05 56 62 68 75.05 82 91 Max 11.6 12.6 13.7 15.8 16.8 18.9 21 23.1 25.2 28.4 31.5 34.7 37.8 41 45.2 49.4 53.6 58.8 65.1 71.4 78.8 86.1 95.5 @ IT mA 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 VC @ IPP (Note 6) VC Volts 15.6 16.7 18.2 21.2 22.5 25.2 27.7 30.6 33.2 37.5 41.4 45.7 49.9 53.9 59.3 64.8 70.1 77 85 92 103 113 125 IPP Amps 38 36 33 28 27 24 22 20 18 16 14.4 13.2 12 11.2 10.1 9.3 8.6 7.8 7.1 6.5 5.8 5.3 4.8 QVBR %/C 0.075 0.078 0.081 0.084 0.086 0.088 0.09 0.09 0.094 0.096 0.097 0.098 0.099 0.1 0.101 0.101 0.102 0.103 0.104 0.104 0.105 0.105 0.106 Ctyp (Note 7) pF 865 800 740 645 610 545 490 450 415 370 335 305 280 260 240 220 205 185 170 155 140 130 120
Device* P6SMB11CAT3, G P6SMB12CAT3, G P6SMB13CAT3, G P6SMB15CAT3, G P6SMB16CAT3, G P6SMB18CAT3, G P6SMB20CAT3, G P6SMB22CAT3, G P6SMB24CAT3, G P6SMB27CAT3, G P6SMB30CAT3, G P6SMB33CAT3, G P6SMB36CAT3, G P6SMB39CAT3, G P6SMB43CAT3, G P6SMB47CAT3, G P6SMB51CAT3, G P6SMB56CAT3, G P6SMB62CAT3, G P6SMB68CAT3, G P6SMB75CAT3, G P6SMB82CAT3, G P6SMB91CAT3, G
Device Marking 11C 12C 13C 15C 16C 18C 20C 22C 24C 27C 30C 33C 36C 39C 43C 47C 51C 56C 62C 68C 75C 82C 91C
4. A transient suppressor is normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC or continuous peak operating voltage level. 5. VBR measured at pulse test current IT at an ambient temperature of 25C. 6. Surge current waveform per Figure 2 and derate per Figure 3 of the General Data - 600 Watt at the beginning of this group. 7. Bias Voltage = 0 V, F = 1 MHz, TJ = 25C *The "G'' suffix indicates Pb-Free package available. Please refer back to Ordering Information on front page.
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P6SMB11CAT3 Series
100 NONREPETITIVE PULSE WAVEFORM SHOWN IN FIGURE 2 10 tr 10 ms 100 VALUE (%) PEAK VALUE - IPP I HALF VALUE - PP 2 PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IPP.
PP, PEAK POWER (kW)
1
50 tP
0.1 0.1 ms
1 ms
10 ms 100 ms tP, PULSE WIDTH
1 ms
10 ms
0
0
1
2
t, TIME (ms)
3
4
5
Figure 1. Pulse Rating Curve
Figure 2. Pulse Waveform
160 PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ T = 25 C A 140
1000 P6SMB11CAT3G P6SMB18CAT3G C, CAPACITANCE (pF) P6SMB47CAT3G 100
120 100 80 60 40 20 0 0 25 50 75 100 125 150
P6SMB91CAT3G 10 TJ = 25C f = 1 MHz 1 1 10 BIAS VOLTAGE (VOLTS) 100
TA, AMBIENT TEMPERATURE (C)
Figure 3. Pulse Derating Curve
Figure 4. Typical Junction Capacitance vs. Bias Voltage
TYPICAL PROTECTION CIRCUIT
Zin
Vin
LOAD
VL
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P6SMB11CAT3 Series
APPLICATION NOTES
RESPONSE TIME
In most applications, the transient suppressor device is placed in parallel with the equipment or component to be protected. In this situation, there is a time delay associated with the capacitance of the device and an overshoot condition associated with the inductance of the device and the inductance of the connection method. The capacitive effect is of minor importance in the parallel protection scheme because it only produces a time delay in the transition from the operating voltage to the clamp voltage as shown in Figure 4. The inductive effects in the device are due to actual turn-on time (time required for the device to go from zero current to full current) and lead inductance. This inductive effect produces an overshoot in the voltage across the equipment or component being protected as shown in Figure 5. Minimizing this overshoot is very important in the application, since the main purpose for adding a transient suppressor is to clamp voltage spikes. The SMB series have a very good response time, typically < 1 ns and negligible inductance. However, external inductive effects could produce unacceptable overshoot. Proper circuit layout, minimum lead lengths and placing the
suppressor device as close as possible to the equipment or components to be protected will minimize this overshoot. Some input impedance represented by Zin is essential to prevent overstress of the protection device. This impedance should be as high as possible, without restricting the circuit operation.
DUTY CYCLE DERATING
The data of Figure 1 applies for non-repetitive conditions and at a lead temperature of 25C. If the duty cycle increases, the peak power must be reduced as indicated by the curves of Figure 6. Average power must be derated as the lead or ambient temperature rises above 25C. The average power derating curve normally given on data sheets may be normalized and used for this purpose. At first glance the derating curves of Figure 6 appear to be in error as the 10 ms pulse has a higher derating factor than the 10 ms pulse. However, when the derating factor for a given pulse of Figure 6 is multiplied by the peak power value of Figure 1 for the same pulse, the results follow the expected trend.
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P6SMB11CAT3 Series
OVERSHOOT DUE TO INDUCTIVE EFFECTS Vin (TRANSIENT) VL VL
V
Vin (TRANSIENT)
V
Vin td tD = TIME DELAY DUE TO CAPACITIVE EFFECT t
t
Figure 5.
Figure 6.
1 0.7 0.5 DERATING FACTOR 0.3 0.2 0.1 0.07 0.05 0.03 0.02 10 ms 0.01 0.1 0.2 0.5 1 2 5 10 D, DUTY CYCLE (%) 20 50 100 100 ms PULSE WIDTH 10 ms
1 ms
Figure 7. Typical Derating Factor for Duty Cycle
UL RECOGNITION The entire series has Underwriters Laboratory Recognition for the classification of protectors (QVGV2) under the UL standard for safety 497B and File #116110. Many competitors only have one or two devices recognized or have recognition in a non-protective category. Some competitors have no recognition at all. With the UL497B recognition, our parts successfully passed several tests including Strike Voltage Breakdown test, Endurance Conditioning, Temperature test, Dielectric Voltage-Withstand test, Discharge test and several more. Whereas, some competitors have only passed a flammability test for the package material, we have been recognized for much more to be included in their Protector category.
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P6SMB11CAT3 Series
PACKAGE DIMENSIONS
SMB DO-214AA CASE 403A-03 ISSUE F
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM A A1 b c D E HE L L1 MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.13 2.45 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.096 0.008 0.087 0.012 0.156 0.181 0.220 0.063
HE E
b
D
A
L
L1
c
A1
SOLDERING FOOTPRINT*
2.261 0.089
2.743 0.108
2.159 0.085
SCALE 8:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
SURMETIC is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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P6SMB11CAT3/D

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